XPG LANCER BLADE

PC 32 GB DDR5. 2 x 16 GB. CAS latency: 45. 1.1,1.4 V. ECC. Intel Extreme Memory Profile (XMP) 3.0. LANCER BLADE DDR5. SLEEK EFFICIENCY, COMPACT POWER. Compact Low-Profile Heatsink Design. The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.. Enhanced Power Management. The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.. Stability and Reliability. With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.. Made with High-Quality Materials. High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.. AMD EXPO. Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.. Overclocking Made Easy. With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.. Features. Cooling type. Heatsink. Intel Extreme Memory Profile (XMP) version. 3.0. Intel Extreme Memory Profile (XMP). Yes. Memory voltage. 1.1,1.4 V. CAS latency. 45. ECC. Yes. Component for. PC. Memory clock speed. 5600 MHz. Internal memory type. DDR5. Memory layout (modules x size). 2 x 16 GB. Internal memory. 32 GB. Buffered memory type. Unregistered (unbuffered). Operational conditions. Storage temperature (T-T). -20 - 65 °C. Operating temperature (T-T). 0 - 85 °C. General. Product family. LANCER BLADE. Weight & dimensions. Weight. 32.9 g. Height. 7.8 mm. Depth. 133.3 mm. Width. 33.8 mm. Packaging data. Package type. Blister